Shenzhen, 29.08 – 31.08.2017

NEPCON Shenzhen

Visit us at NEPCON Shenzhen from 29 – 31 August 2017!

Our team will advise you on the latest technologies from Rehm and we will present our VisionXP+ Vac and CondensoXC for best soldering processes.

See first-hand our new and innovative products from the world of electronics manufacturing. You will find us at booth 1J55.



Shenzhen Convention & Exhibition Center
Fuhua Third Road
Futian Central District Shenzhen

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