Just 3 steps to the creation of a profile – and just 5 for vacuum!

Profiling can be so easy! With Rehm’s CondensoX you only have to complete three steps in order to create an ideal profile for your PCB. Furthermore, you’re provided with endless profiling options, allowing you to further refine and adapt your profile depending on the PCB and the specified requirements.

As a rule, however, the following 3 steps are enough to arrive at your goal – the ideal temperature profile for your application:

  1. Injection of the Galden® | preheating of the PCB

  2. Injection of the Galden® | ideal soldering temperature

  3. Exhaust of the Galden® | cooling of the PCB

Reliable, reproducible solder joints

During the first step, the PCBs are preheated by injecting the Galden® by means of our patented injection process. The ideal soldering temperature is then achieved by injecting additional Galden® during the second step. Subsequently, the medium is exhausted from the process chamber and the PCB is cooled down during the third step – finished! Profiling can’t be any easier than this!

The results are reliable, reproducible solder joints!

Just 5 steps to vacuum!

Vacuum not only assures uniform injection of the Galden®, it also allows for outgassing of solvents from the solder paste. Vacuum during the melting phase makes it possible for gases still present in the solder paste to escape even better, thus providing for surface adhesion of greater than 98%.

  1. Pre-vacuum | uniform distribution of the Galden®
     
  2. Injection of the Galden® | preheating of the PCB
     
  3. Injection of the Galden® | ideal soldering temperature
     
  4. Vacuum during the melting phase | void-free solder joint
     
  5. Exhaust of the Galden® | cooling of the PCB
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