Achieve the best results with our test equipment
Thanks to a competent team and a generous availability of test equipment we are also in a position to detect potential sources of faults in your process and to determine the appropriate methods for eliminating them. Damaged components, tombstones, solder splashes and voids are typical problems that can occasionally arise even for experienced users. We check the module for you, its condition and the appearance of the soldered joint in question.
In our Technology Center we have modern equipment for detecting fault sources, including optical inspection systems and x-ray equipment. In the event of failed joints to particularly valuable modules or in small batches or prototypes it is also possible to make retrospective placements on the board using an accurate positioning and assembly platform and to rework the board.