Pores and voids drastically affect the quality of the joint, and thus also the performance of the module. The demand for void-free joints is therefore growing in electronics manufacturing. At our Technology Center you can use an x-ray system with digital imaging to examine soldered joint results for pores, gas inclusions and other effects. The images make the quality of soldering visible and may enable you in certain cases to make decisions in respect of further vacuum processes. You then profit from the best soldering outcomes and your customers can take advantage of the full performance of your electronics products.