Ideal Heat Transfer

Heat transfer has been significantly optimized for the VisionXS through the use of two or three peak zones. Minimal distance between the nozzle sheets and the conveyor, as well as separately adjustable flow rates for the upper and lower heat zones, assure that the PCBs are heated up in an extremely uniform fashion. Stressing within the PCBs is thus minimized, and related soldering defects are reduced.

Process stability

All heating zones are controlled individually, with an optimum thermal separation from each other, this mimimizes thermal influence of adjacent zones. Thereby a flexible profile guidance and a stable reflow process are ensured.  Special design of hole type nozzle fields provides a homogeneous heat input of the process gas over the entire process zone and thus an absolute homogeneous heating of the package. This results in best process stability with minimum Delta T.