Wir gehen in die Tiefe 2021

Following the forced cancellation of the event in 2020, the seminar on the latest trends in assembly and connection technology, ‘Wir gehen in die Tiefe’, will be held as a face-to-face event once again this year. The venue will run from 21 to 23 September 2021 at the Penta Hotel, Leipzig.

In twelve specialist talks, plus direct experience exchange with high-level specialists and other colleagues, the seminar "Wir gehen in die Tiefe – Seminar für aktuelle Trends in der Aufbau- und Verbindungstechnologie" provides a comprehensive overview of which technologies look set to hold the greatest prospects for success. The keynote speaker this year will be Joey Kelly, with a talk entitled ‘NO LIMITS’.

For Rehm Thermal Systems, Gianfranco Sinistra (product sales for Dispensing | Coating) will speak on Wednesday 22 September at 11.15 on ‘ Dispensing and coating for the protection of electronic assemblies’. Coating technology in the electronics industry continues to advance. The many materials and application methods are specifically tailored to the assembly being manufactured. It can be easy to lose sight of all the possibilities. In this talk, the speaker will explain how choosing and implementing appropriate procedures need not be unnecessarily complicated and how the perfect material application can be achieved in just a few steps.

Registration for ‘Wir gehen in die Tiefe’ is online and available here.