展会及活动

活动日历

Vacuum soldering has been a proven technique for decades in contactheat and vapour phase soldering systems, significantly reducing gasbubbles in…

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Vacuum soldering has been a proven technique for decades in contactheat and vapour phase soldering systems, significantly reducing gasbubbles in…

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Bondexpo 2021

Bondexpo is regarded as the leading trade fair for bonding technology and is an important industry meeting place for all aspects of industrial joining…

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The coating technology in the electronics industry continues to advance. The wide range of materials and application methods are specially adapted to…

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The coating technology in the electronics industry continues to advance. The wide range of materials and application methods are specially adapted to…

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NEPCON Asia 2021

Rehm's trade fair presence at NEPCON Asia 2021 in Shenzhen

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Visit us at evertiqExpo in Warsaw!

Poland's largest electronics industry exhibition will take place on 28 October 2021 at the Narodowy Stadium in…

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productronica 2021

After an almost two-year break due to the pandemic, the eagerly awaited first international industry meeting with numerous exhibitors – hailing mainly…

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Visit us at Semicon Taiwan on 28 December 2021 - at our booth in TaiNEX 1.

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聯繫人顯示和事件

Annika Erhard
研討會組織
Phone +49 7344 96 06-433        
Fax +49 7344 96 06-662
a.erhard@rehm-group.com