Contact soldering under vacuum is best suited for void-free soldering of different components (e.g. IGBT) on DBC substrates. Materials that are normally highly dissimilar are fused under vacuum at temperatures of up to 450 °C. The reduced pressure helps to minimise oxidation on the components and on the solder itself. The heat is transferred both via thermal conduction and optionally by radiation....

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Some of the most important trade fairs in the electronics sector will be taking place in Asia in the next few weeks: Nepcon South China (Shenzhen), Nepcon Vietnam, and Semicon Taiwan. Rehm Thermal Systems will also be exhibiting its product portfolio at these trade fairs and introducing visitors to Rehm’s new developments and innovations in system and process technologies. Attendees will also be...

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The SMTA shows, organised by the Surface Mount Technology Association (SMTA), provide manufacturers of production equipment for the electronics industry, as well as interested trade visitors, with platforms to discuss and exchange professional opinions on the latest industry trends, challenges and opportunities. Rehm Thermal Systems is taking part in three SMTA shows in the US and Mexico in August...

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As with many other thermal processes, the soldering of electronic assemblies creates solder fumes, aerosols and solid particles (residues) that need to be removed from the process cycle. With the VisionXP+, Rehm Thermal Systems has established an effective residue management system for reflow convection soldering. The continuing development of this in collaboration with customers and experience...

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Anna-Lena Kast
Public Relations
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