08/29/2019

Bondexpo is regarded as a leading trade fair for bonding technology and is an important venue for companies involved in industrial dispension and attaching. Over 50 exhibitors will be present at the Stuttgart trade fair site between 7 and 10 October, among them Rehm Thermal Systems with its product portfolio covering the fields of dispensing, adhesive technology and application processes. This...

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08/22/2019

The demand for high-performance electronics is growing worldwide, driven by higher demand from for example the electro-mobility and LED global lighting industries. These different electronic applications require solder joints with as few voids as possible in both their structure and connection. To produce solder joints with very few voids consistently, soldering systems with vacuum chambers are...

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08/14/2019

Some of the most important trade fairs in the electronics sector will be taking place in Asia in the next few weeks: Nepcon South China (Shenzhen), Nepcon Vietnam, and Semicon Taiwan. Rehm Thermal Systems will also be exhibiting its product portfolio at these trade fairs and introducing visitors to Rehm’s new developments and innovations in system and process technologies. Attendees will also be...

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08/07/2019

The SMTA shows, organised by the Surface Mount Technology Association (SMTA), provide manufacturers of production equipment for the electronics industry, as well as interested trade visitors, with platforms to discuss and exchange professional opinions on the latest industry trends, challenges and opportunities. Rehm Thermal Systems is taking part in three SMTA shows in the US and Mexico in August...

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Contact

Anna-Lena Kast
Public Relations
T +49 (0) 73 44 - 96 06 746
F +49 (0) 73 44 - 96 06 525
an.kast@rehm-group.com