The transport of the PCB’s in the CondensoX-Line  is worked out throughout the entire process by a workpiece carrier, which are moved to the respective positions required for the process. For loading of the workpiece carrier, the PCB’s are sequentially pushed by a pusher from the peripheral device to the predefined positions on the workpiece carrier. Once the goods carrier is fully loaded, it is transported to the next process step. In parallel, the next workpiece carrier is already loaded, so that the process chain must not be interrupted. After the soldering process is completed the workpiece carrier is also discharged by a pusher and handed over to the empty workpiece carrier in the return transport and can then be loaded again.

Safe and protected transport

The board carrier dimension is 650 x 650mm and varies at the height ( Version 1: 0 - 80 mm | Version 2: -20 - 65 mm). The workpiece carrier can be equipped with up to 6 lanes and has a fixed side-panel which serves as a starting point, as well as five adjustable crosspieces.

The assemblies are transported strictly horizontally through the soldering system. Furthermore, the PCB is stationary during the soldering process. In this way, components cannot be shifted out of place while the solder is molten. It has thus been possible to eliminate a considerable disadvantage associated with conventional vapour phase soldering systems within which continuous vertical motion of the PCBs is required during soldering. Scrap rates are reduced as a result, as well as costs.

Advantages at a glance

  • Horizontal transport
  • PCBs are still during the complete process
  • High speed handling systems for high throughput
  • Continuous inert process atmosphere
  • Inline vacuum process
  • Easy, accurate temperature profiling
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