Vacuum process for void-free solder joints

Void-free soldering with lead-free solders is an important prerequisite for the production of power electronics. However, minimal void rates are only possible with soldering processes during which the molten solder is subjected to a vacuum, making it easier for any remaining residues to escape from the solder joints. For this reason, the Condenso can be equipped with a vacuum pump upon request. This results in solder joints with surface contact ratios of greater than 99% in some cases.

In addition to the vacuum process during the melting phase, a vacuum can also be generated before the actual soldering process. This not only assures uniform injection of the Galden®, it also allows for outgassing of solvents from the solder paste. Moreover, the Condenso can replace the oxygen in the chamber with nitrogen thanks to the use of the pre-vacuum function. Oxidation problems are avoided as a result.

Optimized results thanks to vacuum!

There are lots of applications, for example in the field of component manufacturing for power electronics, in which low void rates are specified.  However, such low void rates can only be realized with soldering processes by means of which the molten solder is subjected to a vacuum. This, as well, is no problem for the CondensoX product range – with just two additional steps: vacuum generation during the melting phase and an option for pre-vacuum prior to the actual soldering process, thus making it possible to achieve void-free solder joints in just five steps.

without vacuum

with vacuum