Optimal reflow profiling

In order to achieve the best results with reflow soldering, the individual profile of temperature against time, known as the ‘reflow profile’, must be obtained for each process. Once this analysis is obtained, the soldering system can be perfectly matched to your production facility in terms of process stability and energy consumption. The reflow profile varies with thermal mass and the material properties and constitution of the various components on the board. Without a specific reflow profiling it is possible that sensitive components may be overheated, damaged or become unstable, with consequent loss or restriction of function. To ensure that such errors are avoided we will work alongside you to obtain the optimal temperature profiles – matched exactly to the product you wish to produce. If required you can also learn about measurement procedures to evaluate your profiling and to improve your production processes in the long term.

ContactImprintPrivacyConditions of Purchase