The technical design of Rehm systems is largely determined by part dimensions, thermal mass, materials, process specifications and throughput volume and/or cycle times. Using our excellent technological know-how and many years of experience in plant and mechanical engineering, we design thermal system solutions that match individual applications precisely.
The Rehm RSS machines have a modular design that can be variably equipped with convection or IR radiators. For example, the heating system can reduce the cooling gradient to a minimum using additional underside heating.
As an innovation leader, Rehm Thermal Systems is involved in several work groups and research projects. One of these projects is: "New products through reel-to-reel manufacturing of MID-based micro-systems – PRONTO R2R-MID".
The backside-reflow technology was developed for complex, double-sided boards that are densely packed with SMD parts and that are not suitable for wave soldering. Selective reflow soldering and even manual soldering are therefore the only ways to solder thermally-sensitive THD.
Our vacuum high-temperature soldering system with top loading is ideal for high throughput processes. The high-temperature soldering process is performed using forming gas exceeding 400°C. Clean soldering joints can also be achieved through a defined temperature-time-process with changing atmospheres.
Thanks to the meander construction, a big amount of parts can be guided through the process chamber maintaining their orientation exactly. The loading position is outside the chamber, loading manually or via robot.
Individual System SolutionsFurther Examples
Tunnel magazine dryers
for hardening printed ceramic substrates
Dryer for manufacturing battery film
for hardening sheet metal parts
for hardening conductive adhesives