Reliable contact soldering – The Nexus makes it possible!

The Rehm Thermal Systems vacuum soldering oven is exceptionally well suited for production facilities which pursue flux-free and void-free soldering in various inert gases (N2, H2, N2/H2 95/5).

The use of lead-free and lead-containing pastes and preforms with/without flux is also possible. Miniaturization in the fields of advanced packaging and semiconductors can be further developed by means of vacuum technology.

 

 

Unique technology advantages

  • Oxide and void-free joint surface between chip and interconnected device
  • Integrated or separate cleaning and de-scaling processes
  • Simple profiling and fast heating and cooling rates
  • Assembly under high level of vacuum
  • Integration of drying and degassing processes
  • Optimum dispersal of waste heat
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