Bondexpo 2022


Bondexpo is considered the leading trade fair for adhesive bonding technology and is an important industry meeting place for all aspects of industrial joining and bonding.

From October 4 to 7, exhibitors will present themselves at the Stuttgart trade fair center, including Rehm Thermal Systems with its product portfolio in the areas of dispensing, bonding technologies and application processes. With the clear and consistent focus of Bondexpo on the joining/bonding process chain through bonding, potting, sealing and foaming, economical detailed and system solutions are offered for the current and future challenges in the area of joining and bonding a wide variety of materials.