From October 8 to 11, exhibitors will present themselves at the Stuttgart trade fair center, including Rehm Thermal Systems with its product portfolio in the areas of dispensing, bonding technologies and application processes.
With Bondexpo's clear and consistent focus on the joining/bonding process chain through bonding, potting, sealing and foaming, economical detailed and system solutions are offered for current and future challenges in the area of joining and bonding a wide variety of materials.
Come by - the Rehm Thermal Systems team is looking forward to seeing you!
You will find us in Hall 5 - Booth 5505!
