In condensation reflow soldering, or vapor-phase soldering, soldering is accomplished using a hot vapor. Heat transfer in condensation soldering is up to ten times higher than in convection soldering. This makes it particularly suitable for processing large or high-mass boards in a stable process atmosphere. The inert heat transfer medium used is perfluoropolyether (Galden®).
Our Condenso series can solder even the most difficult assemblies quickly and dependably, at temperatures up to 240°C. In order to improve control of the condensation phase, Rehm has developed a patented injection process that allows the soldering procedure to be individually regulated. An optional vacuum module ensures void-free soldered joints – directly after the soldering process or as a pre-vacuum. Our systems let you adjust all parameters, such as pressure or temperature, flexibly – for the best soldering results that exactly match the requirements of your manufacturing.
Product film Condenso series
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