Top performance with or without vacuum

In condensation reflow soldering, or vapor-phase soldering, soldering is accomplished using a hot vapor. Heat transfer in condensation soldering is up to ten times higher than in convection soldering. This makes it particularly suitable for processing large or high-mass boards in a stable process atmosphere. The inert heat transfer medium used is perfluoropolyether (Galden®).

Our Condenso series can solder even the most difficult assemblies quickly and dependably, at temperatures up to 240°C. In order to improve control of the condensation phase, Rehm has developed a patented injection process that allows the soldering procedure to be individually regulated. An optional vacuum module ensures void-free soldered joints – directly after the soldering process or as a pre-vacuum. Our systems let you adjust all parameters, such as pressure or temperature, flexibly – for the best soldering results that exactly match the requirements of your manufacturing.

Condensation Soldering



Product film Condenso series

You can watch this and our other product films live at our stand or at an appointment with your contact person.

We look forward to your visit.

Your Contact Person

Michael Hanke
C.S.O. Chief Sales Officer

Phone: +49 7344 9606-517
Mobile: +49 160 2813251
Fax: +49 7344 9606-525

If you have any questions, please do not hesitate to contact us.

You can find your regional contact person here.