шоу и мероприятия
Event Calendar

Bondexpo 2022

Bondexpo is considered the leading trade fair for adhesive bonding technology and is an important industry meeting place for all aspects of industrial…

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Nepcon Asia

Visit us at NEPCON Asia from October 12-14 in Shenzhen.

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Контактные шоу и события

Annika Erhard
Организация семинаров
T +49 7344 96 06-433        
Ф +49 7344 96 06-662
a.erhard@rehm-group.com