Compact oven technology combines stationary full-area exposure, high homogeneity and resource-efficient process control for conformal coatings, adhesives and potting compounds in electronics manufacturing.
From Shanghai to Seoul and Greater Noida, Rehm showcases advanced reflow soldering, vapor phase, vacuum, dispensing, and coating technologies for the next generation of electronics manufacturing
IPC APEX EXPO 2026 takes place from March 17–19, 2026 at the Anaheim Convention Center (California) and is one of North America’s leading platforms for electronics manufacturing. Rehm Thermal Systems will present current solutions for conformal coating and dispensing, resource-efficient vapor phase soldering, and nitrogen reflow soldering. Visit us at booth 942 and experience our technologies live…