Successful seminar in Chongqing, China

Vacuum soldering has proven itself over the past decades, especially in contact heat and vapour phase soldering systems, and significantly reduces gas bubbles in solder joints. What this means with regard to convection soldering was explained by the Rehm experts in this seminar. The seminar specifically dealt with the basics of pore formation, the effect of the vacuum on the formation of voids and a comparison of vacuum soldering systems under convection, condensation and contact heat. Most of the participants came from the automotive, automation technology, equipment and systems for wireless communication and aerospace sectors.