Vacuum soldering has been a proven technique for decades in contactheat and vapour phase soldering systems, significantly reducing gasbubbles in…
Bondexpo is regarded as the leading trade fair for bonding technology and is an important industry meeting place for all aspects of industrial joining…
The coating technology in the electronics industry continues to advance. The wide range of materials and application methods are specially adapted to…
Rehm's trade fair presence at NEPCON Asia 2021 in Shenzhen
Visit us at evertiqExpo in Warsaw!
Poland's largest electronics industry exhibition will take place on 28 October 2021 at the Narodowy Stadium in…
After an almost two-year break due to the pandemic, the eagerly awaited first international industry meeting with numerous exhibitors – hailing mainly…
Visit us at Semicon Taiwan on 28 December 2021 - at our booth in TaiNEX 1.
Annika Erhard Seminar Organisation Phone +49 7344 96 06-433 Fax +49 7344 96 firstname.lastname@example.org
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