Increasing power density and thermally demanding assemblies require soldering processes with minimal voiding, oxide-free surfaces and maximum reliability.
In this webinar, we will present the advantages of Vapour Phase Soldering based on the patented injection principle. Precise control of temperature and pressure ensures uniform heat transfer, reproducible reflow profiles and safe processing of high-mass assemblies such as IGBTs on copper heat sinks.
A special focus is the integration of Formic Acid (HCOOH) Technology. The two-stage deoxidation process enables flux-free, residue-free soldering, significantly reduces void formation and improves wetting and thermal performance — without post-cleaning. Learn how optimized activation time and process control create nearly void-free solder joints for demanding applications in power electronics, e-mobility and aerospace.
Join our experts and discover the next level of Rehm vapor phase soldering process.
Start: 4:00 p.m. CET (for Americas, Europe)
Duration: 60 min
Register now at following link:
The webinar is free of charge.
LIVE WEBINAR - Vapour Phase Soldering & Formic Acid Technology at 4.00 p.m.
If there are any questions, please contact Irene Zielke, mail: i.zielke@rehm-group.com.
