With the new Vision RCC, Rehm Thermal Systems is introducing an innovative reflow soldering system specifically developed to meet the requirements of heavy and complex electronic assemblies. The patented system concept combines convection preheating, condensation soldering and vacuum technology in a continuous process for the first time in this configuration. This enables the Vision RCC to achieve uniform heating, precisely controlled soldering temperatures and solder joints with exceptionally low void content – even for assemblies weighing up to 25 kg.
The demands placed on modern electronics are continuously increasing. Particularly in power electronics, AI servers and 6G applications, as well as in aerospace and humanoid robotics, increasingly complex assemblies are being used. Large thermal masses, varying component heights and sensitive components place high demands on the soldering process. The Vision RCC addresses precisely these challenges by combining proven technologies in a new, fully coordinated system concept.
Three Technologies, One Continuous Soldering Process
The distinguishing feature of the Vision RCC is the interaction of three coordinated process steps: convection preheating, condensation soldering and subsequent cooling. An integrated vacuum stage additionally ensures solder joints with exceptionally low void content.
In the first process zone, the assemblies are uniformly preheated to approximately 210 °C by convection. This reduces temperature differences between lightweight and massive components even before the actual soldering process begins. At the same time, the Galden® heat transfer fluid is also preheated. This combination makes it possible to significantly shorten the soldering process – by up to 50 percent.
The actual soldering process takes place in a sealed, vacuum-tight chamber. Here, the preheated Galden® is injected using a patented process and vaporised at the bottom of the chamber. As the vapour condenses on the assembly, heat is transferred particularly efficiently and uniformly.
One key advantage of condensation soldering is that the maximum soldering temperature is physically limited by the boiling point of the heat transfer fluid. While lightweight components reach this temperature more quickly, components with higher thermal mass can gradually reach the same temperature without overheating. This ensures uniform temperature conditions across the entire assembly – even when thermal masses vary considerably.
Vacuum Technology for Solder Joints with Exceptionally Low Void Content
Another key feature of the Vision RCC is the combination of condensation soldering and vacuum technology within the same process chamber. Once the solder has melted, the Galden® is extracted and returned to the fluid circulation system. The vacuum process then takes place without the need to move the assembly.
This significantly reduces gas inclusions in the solder joints. Under suitable process conditions, void rates of less than two percent are achievable. This is particularly important for electronic assemblies with demanding requirements for thermal connection and reliability.
Since the amount of Galden® supplied can be precisely controlled, the temperature gradient during the soldering process can also be individually adjusted. This provides additional flexibility when processing different assemblies and materials.
Safe Transport of Heavy Assemblies Without Additional Carriers
The Vision RCC has been specifically designed to process large and heavy assemblies. A three-part transport system allows products weighing up to 25 kg to be moved safely through the individual process zones – without additional carriers.
While preheating and soldering are performed in a cycle-controlled sequence, the separate cooling section operates independently of the cycle time. This allows cooling gradients and exit temperatures to be precisely adapted to the respective requirements. The system also offers flexibility in terms of process atmosphere: depending on the application, processing can take place in air or under nitrogen with a residual oxygen concentration of less than 100 ppm.
The coordinated interaction of the different technologies enables gentle processing of both lightweight and high-mass components. At the same time, it creates the conditions for stable and reproducible soldering processes for demanding assemblies.
Resource-Efficient and Designed for Connected Manufacturing
In addition to soldering quality and process reliability, resource efficiency also plays an important role. The Vision RCC operates with a closed-loop Galden® circulation system. After each soldering cycle, the heat transfer fluid is completely purified and returned to the process. This reduces consumption and supports economical system operation.
For easy operation and transparent process control, the Vision RCC is equipped with Rehm's ViCON operating and control software. Process sequences can be controlled and monitored via the intuitive touchscreen interface. Features for traceability, process analysis and MES connectivity support integration into modern, digitally connected manufacturing environments.
New Opportunities for Demanding Electronics Applications
With the Vision RCC, Rehm Thermal Systems is expanding its portfolio with a reflow soldering system specifically designed to meet the challenges of future generations of electronics. Particularly where heavy assemblies, complex component configurations and widely varying thermal masses come together, the combination of convection, condensation and vacuum technology opens up new opportunities for reliable and cost-effective manufacturing.
