With a massive display area of 60,000 square meters, this exhibition is expected to host over 600 top-tier global brands and manufacturers and attract 50,000+ professional visitors, showcasing industry innovations in the fields of electric vehicles, power and energy storage, embedded systems, AIoT, SiP, and advanced packaging. Additionally, there will also be more than 20 high-level forums that offer insights into global industry trends and future technological advancements.
Rehm Thermal Systems will present a VX Semico, a VXP+VAC reflow vacuum soldering system and a Condenso XS Smart reflow condensation soldering system in hall 9, booth 9B55.
We are looking forward to your visit!
