Meet Rehm at NEPCON ASIA 2026

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Visit Rehm Thermal Systems at NEPCON ASIA in Shenzhen from October 27–29, 2026 – booth 11E70.

Discover innovative solutions for modern electronics manufacturing. 

At NEPCON ASIA, Rehm will showcase the VXP+Vac for convection soldering with vacuum, the Condenso vapor phase soldering system, the Nexus vacuum contact soldering system, the Protecto coating solution, and the RDS UV LED for fast and reliable curing of UV materials. 

Our team looks forward to welcoming you at booth 11E70 and discussing your individual production requirements.