At SSPA, Rehm is showcasing state-of-the-art vacuum technologies. A particular highlight is the Condenso, which solder even the most demanding assemblies quickly and reliably at temperatures of up to 240 °C. The patented injection process allows for individual control of the soldering process and ensures precise profiling. An optional vacuum module ensures void-free solder joints – either immediately after the soldering process or as part of a pre-vacuum.
Booth #D102.
Further information can be found here.
