Inline condensation soldering with vacuum

The CondensoX-Line has brought a system to market that enables vacuum condensation soldering processes to be easily integrated into standard SMD lines. This allows void-free solder joints to be manufactured in a completely inert process environment (<100ppm O2), whether they are standard modules with BGA devices or DCB substrates for power electronics.

By building a 3-chamber system, low cycle times can be achieved for inert soldering processes. The first chamber already provides a protective atmosphere of nitrogen for the products before they are transported into the actual soldering process. The second, vacuum-compatible process chamber can be purged with nitrogen or forming gases and offers an inert or activating and void-reducing process atmosphere throughout the soldering process. In addition, here formic acid can optionally be used for flux-free processing - a novelty in the world of vapour phase soldering. The final gas-tight cooling chamber provides for controlled and rapid cooling of the assemblies by means of adjustable convection with less than 100 ppm residual oxygen in the atmosphere.
With the advantages of the inline condensation soldering process, a high throughput, and the creation of an inert atmosphere in the entire system, the CondensoX-Line meets the highest demands of mass production in the power electronics.


Unique technological Advantages

  • Ideal for the processing of massive assemblies (IGBT, Heatsinks) down to sensitive sub-modules (01005, 03015)
  • Reliable condensation soldering process for SMD manufacturing in a continuous process
  • Horizontal transport of the modules of the entire process
  • Inert process atmosphere during the entire soldering process for increased reliability of the assembly
  • Cooling section can be used with <100ppm residual oxygen, ideal for subsequent bonding processes and surfaces to be protected against oxidation
  • Void-free soldering with the use of vacuum for best results
  • Significantly higher throughput when compared with stand-alone systems or batch systems, thanks to the multi-chamber structure
  • Easy line integration
  • Best traceability of soldering processes

A patented principle for reliable, void-free solder joints

Condensation or vapor phase soldering makes use of heat released during the transition from the vaporous to the liquid state in order to heat up the PCB to be soldered. Temperature remains continuously constant during the medium’s change of state (phase transition). As a result, the maximum temperature of the PCB cannot exceed the boiling point of the medium (Galden®), or its condensation temperature.

The soldering process takes place in a sealed process chamber. The vapor allows for extremely effective heat transfer to the PCBs due to the release of heat during condensation. In addition to this, the medium’s boiling point limits the maximum soldering temperature so that the PCBs cannot, under any circumstances, be damaged due to overheating.

As a unique feature in the field of condensation soldering, the handling systems included with the CondensoX series can be subsequently adapted according to the customer’s needs. And thus the basic system grows along with your requirements without forcing you to invest in a completely new system. You simply replace the loading system and are thus provided with optimized production equipment utilization.

Further Information