Optimized vapor phase soldering with extremely small footprint

The CondensoXS is the smallest model included in the CondensoX series. In comparison with the next larger model, the footprint of the CondensoXS is roughly 25% smaller. Nonetheless, the CondensoXS is distinguished by the same process performance as the other models of the Condenso series and can be incorporated into manufacturing environments with comparatively limited space thanks to its small footprint. The CondensoXS from Rehm Thermal Systems is a state-of-the-art condensation soldering system. Especially with regard to complex requirements for lead-free soldering of PCBs with large thermal mass, the CondensoXS can solder your most difficult PCBs quickly and reliably for maximum profitability.

Unique technology benefits

  • Ideal for processing high-mass PCBs
  • Smallest possible ΔT
  • Extremely effective and homogenous heat transfer over the entire PCB
  • Maximum soldering temperature limited by the medium’s boiling point
  • A patented injection process assures reproducible soldering results and permits ideal profiling
  • Void-free soldering thanks to vacuum option for best possible results
  • Gradient control
  • No time lost with profiling
  • Outstanding retraceability of all processes with wireless profiling system (WPS)

A patented principle for reliable, void-free solder joints

Condensation or vapor phase soldering makes use of heat released during the transition from the vaporous to the liquid state in order to heat up the PCB to be soldered. Temperature remains continuously constant during the medium’s change of state (phase transition). As a result, the maximum temperature of the PCB cannot exceed the boiling point of the medium (Galden®), or its condensation temperature.

The soldering process takes place in a sealed process chamber. The vapor allows for extremely effective heat transfer to the PCBs due to the release of heat during condensation. In addition to this, the medium’s boiling point limits the maximum soldering temperature so that the PCBs cannot, under any circumstances, be damaged due to overheating.

As a unique feature in the field of condensation soldering, the handling systems included with the CondensoX series can be subsequently adapted according to the customer’s needs. And thus the basic system grows along with your requirements without forcing you to invest in a completely new system. You simply replace the loading system and are thus provided with optimized production equipment utilization.