Rehm presents product portfolio in Moscow

As an established manufacturer of reflow soldering systems, Rehm Thermal Systems has already made a name for itself on the Eastern European electronics market in recent years and is now presenting innovative technologies in the field of thermal system solutions for reflow soldering, including the CondensoXC vapor phase soldering system, at ElectronTechExpo in Moscow, Russia. The trade fair appearance at the ElectronTechExpo in Moscow is Rehm's first presence at a trade fair since the beginning of the worldwide corona pandemic.

The ElectronTechExpo in Moscow is Russia's largest electronics trade fair and takes place from 13 to 15 April. Interested trade fair visitors will have the opportunity to visit Rehm Thermal Systems at the exhibition stand and find out about the latest developments in the field of reflow soldering under convection and condensation as well as innovative conformal coating technology in Pavilion 3, Hall 14, Stand A3021 and receive advice from the Rehm experts on site.

The CondensoXC vapor phase soldering system will also be presented on the Rehm Thermal Systems stand. Thanks to the innovative process chamber, this system has a compact design and high performance. Thanks to the patented injection principle, exactly the right amount of Galden® is fed into the process for optimum profiling. Almost 100 % of the medium can be recovered and filtered via the closed-loop filter system. The system is fully vacuum-compatible and has an integrated process recorder - for optimal traceability.