News

Low-void soldering by vacuum

The demand for high-performance electronics is growing worldwide, driven by higher demand from for example the electro-mobility and LED global lighting industries. These different electronic applications require solder joints with as few voids as possible in both their structure and connection. To produce solder joints with very few voids consistently, soldering systems with vacuum chambers are…

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Trade fair exhibitions in China, Vietnam and Taiwan

Some of the most important trade fairs in the electronics sector will be taking place in Asia in the next few weeks: Nepcon South China (Shenzhen), Nepcon Vietnam, and Semicon Taiwan. Rehm Thermal Systems will also be exhibiting its product portfolio at these trade fairs and introducing visitors to Rehm’s new developments and innovations in system and process technologies. Attendees will also be…

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Focus on professional exchange

The SMTA shows, organised by the Surface Mount Technology Association (SMTA), provide manufacturers of production equipment for the electronics industry, as well as interested trade visitors, with platforms to discuss and exchange professional opinions on the latest industry trends, challenges and opportunities. Rehm Thermal Systems is taking part in three SMTA shows in the US and Mexico in August…

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Clean soldering systems with pyrolysis technology

As with many other thermal processes, the soldering of electronic assemblies creates solder fumes, aerosols and solid particles (residues) that need to be removed from the process cycle. With the VisionXP+, Rehm Thermal Systems has established an effective residue management system for reflow convection soldering. The continuing development of this in collaboration with customers and experience…

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