The best coating solutions, reliable drying processes - and a wide range of possible applications. The Protecto systems from Rehm Thermal Systems are also convincing outside of conformal coating. For example, both the Protecto XP and the Protecto XC are equipped with four or three multifunctional applicators that can be used simultaneously. The advantages for our customers: The right tool even for individual applications and processes - and the best possible results throughout.
Dam & Fill" uses two materials with different viscosities. First, a dam is placed around the component to be protected using a highly viscous material. If a UV-curing material is used, it can be cured directly with the aid of a suitable UV spot. The component can then be potted in the same operation using a low-viscosity material.
Underfills increase the mechanical stability between the chip and the circuit board and distribute locally occurring voltages over a larger area, which significantly increases the service life. For this purpose, a low-viscosity material is applied along the edge region of the chip, which then independently fills the gap between the chip and the circuit board using the capillary effect.
Due to the constant miniaturisation in electronics, less and less surface is available for heat dissipation. This makes it all the more important to have an optimal passage between the heat sink and the component. Liquid heat-transfer media can be adapted to the individual contours better than fixed pads or foils and ensure a safe heat dissipation, which significantly increases the service life of the components.