Bondexpo is regarded as a leading trade fair for bonding technology and is an important venue for companies involved in industrial dispension and attaching. Over 50 exhibitors will be present at the Stuttgart trade fair site between 7 and 10 October, among them Rehm Thermal Systems with its product portfolio covering the fields of dispensing, adhesive technology and application processes. This…

The demand for high-performance electronics is growing worldwide, driven by higher demand from for example the electro-mobility and LED global lighting industries. These different electronic applications require solder joints with as few voids as possible in both their structure and connection. To produce solder joints with very few voids consistently, soldering systems with vacuum chambers are…

Some of the most important trade fairs in the electronics sector will be taking place in Asia in the next few weeks: Nepcon South China (Shenzhen), Nepcon Vietnam, and Semicon Taiwan. Rehm Thermal Systems will also be exhibiting its product portfolio at these trade fairs and introducing visitors to Rehm’s new developments and innovations in system and process technologies. Attendees will also be…