Physics working for you
During the vapour phase, no part of the assembly can become hotter than the boiling point of the heat-transfer medium. Lightweight components reach this limit first and remain there, while solid components catch up. The result: minimal ΔT without overheating.
Uniform heating to approx. 210°C reduces ΔT and – together with the preheated Galden® – shortens the soldering time.
Soldering and vacuum in a single chamber
The vacuum-tight chamber is maintained at a constant temperature. When injected at the base of the chamber, the preheated Galden® evaporates. The quantity used determines the temperature gradient across the assembly and can be freely adjusted.
After soldering, the Galden® and any residue on the product are extracted and returned to the reservoir. The vacuum process then follows immediately – without moving the product.
The void rate is below 2%.
Three transport systems. Three speeds.
Three independent transport systems move heavy assemblies weighing up to 25 kg safely through the entire process. While transport through the preheating and soldering zones is cycle-controlled, the cooling zone operates independently of the cycle.
This allows the cooling gradient and exit temperature to be precisely adjusted.
